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EXPERT MOBILE REBALLING PASTE
Optimise mobile repair servicing with specialised solder paste engineered for precise motherboard BGA reballing, bright joints, and dependable electrical conductivity.
Highlights
Flawless Mobile Reballing Results Ideal Motherboard Repair Solution
Bright Reliable Solder Joints Continuous 48 Hour Adhesion
Clean Low Residue Formula
Features
  • ✓ Sn63 Pb37 Alloy Composition
  • ✓ Controlled Push Dispensing Design
  • ✓ Optimal Low Melting Flow
  • ✓ Fine Micro Particle Size
  • ✓ Extended 48 Hour Tackiness
  • ✓ Bright Conductive Solder Joints
Why Buy From Us
Precision Mobile BGA Reballing
Ensures uniform solder balls for reliable mobile motherboard chip placement.
High Tack Extended Viscosity
Maintains firm component grip for up to 48 hours continuously.
Clean Low Residue Formula
Leaves minimal non-conductive residue saving valuable repair shop cleaning time.
Bright Durable Solder Joints
Creates high conductivity connections that prevent dry solder joint failures.
Product ID: 12619158
399.0

Solder Paste For BGA Motherboard Repair (MOT3)

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  • 60%
  • M.R.P. : 1,000399 + 101 Shipping(incl. of all taxes)
  • Warranty: 48 Hrs Seller Warranty Against Manufacturing Defects
Seller: QANQC Enterprises Ghaziabad DS+   |   More Sellers

EXPERT MOBILE REBALLING PASTE
Optimise mobile repair servicing with specialised solder paste engineered for precise motherboard BGA reballing, bright joints, and dependable electrical conductivity.
Highlights
Flawless Mobile Reballing Results Ideal Motherboard Repair Solution
Bright Reliable Solder Joints Continuous 48 Hour Adhesion
Clean Low Residue Formula
Features
  • ✓ Sn63 Pb37 Alloy Composition
  • ✓ Controlled Push Dispensing Design
  • ✓ Optimal Low Melting Flow
  • ✓ Fine Micro Particle Size
  • ✓ Extended 48 Hour Tackiness
  • ✓ Bright Conductive Solder Joints
Why Buy From Us
Precision Mobile BGA Reballing
Ensures uniform solder balls for reliable mobile motherboard chip placement.
High Tack Extended Viscosity
Maintains firm component grip for up to 48 hours continuously.
Clean Low Residue Formula
Leaves minimal non-conductive residue saving valuable repair shop cleaning time.
Bright Durable Solder Joints
Creates high conductivity connections that prevent dry solder joint failures.


Package Contents
  • ✓  1X Solder Paste

Country of Origin:

China

Disclaimer: Product shown in the picture above is only for representative and information purposes. The actual product delivered may be different from the creative as displayed here in the website.

Solder Paste For BGA Motherboard Repair (MOT3) Price in India: M.R.P. : 1,000399 + 101 Shipping